BioDreamMachine Exploring Nature's Solutions

IBM has developed a method of using self-assembly techniques inspired by seashells, snowflakes and tooth enamel to create insulating vacuum around wires in computer chips, increasing signal speed by 35 percent or reducing energy by 15 percent.  The process creates holes that are up to five times smaller than those possible using current lithography.  The process is being used at the East Fishkill plant, and will be integrated in other chip lines by 2009.

Also reviewed in PC Magazine: IBM Bakes Up New Nanotech Chip